Phones

Xiaomi’ new flexible screen mobile phone may be equipped with ultrasonic screen fingerprint solution

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Xiaomi is expected to launch a number of new mobile phones starting in August, and in November this year, it is expected to release the Xiaomi 13 / Pro flagship mobile phone equipped with the Snapdragon 8 Gen 2 chip. Today, Weibo blogger @Digital Chat Station hinted that Xiaomi’s new phone will use a flexible screen-based ultrasonic screen fingerprint solution, which has been tested for a long time.

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According to the new patent, the present disclosure provides a fingerprint identification module and a terminal device, which belong to the technical field of fingerprint identification. The fingerprint identification module includes a flexible substrate, an ultrasonic transmitting circuit layer, and an ultrasonic receiving circuit layer.

The ultrasonic wave transmitting circuit layer is located on the first board surface of the flexible substrate and is used for transmitting ultrasonic waves to the outside. The ultrasonic wave receiving circuit layer is located on the second board surface of the flexible substrate and is used for receiving ultrasonic waves reflected from the finger, and the first board surface and the second board surface are opposite to each other.

Since the ultrasonic transmitting circuit layer and the ultrasonic receiving circuit layer of the fingerprint identification module provided by the present disclosure are located on the flexible substrate, the fingerprint identification module can follow the bending of the flexible display panel, so that the fingerprint identification module provided by the present disclosure can be applied in the terminal device using the flexible display panel, fingerprint recognition in the terminal device using the flexible display panel is implemented.

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Qualcomm has previously released the 3D Sonic Max ultrasonic fingerprint sensor, which can avoid fingerprint unlocking failures caused by sweat, moisture, oil, dust, etc., and upgrades in recognition, entry, security, and convenience to improve the user unlocking experience.

The Qualcomm 3D Sonic Max ultrasonic fingerprint sensor can penetrate surfaces such as glass and metal for accurate fingerprint scanning, even when the finger is wet, for example. With a large sensing area, which is 17 times larger than the original product, it can collect a large amount of biometric data in an instant, and can quickly complete the fingerprint set. It supports reading two fingerprints at the same time and adopts a 0.2mm ultra-thin design, which can be completely “hidden” under the screen of the mobile phone.

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