Yesterday, Lu Weibing, general manager of the Redmi brand, began to promote the “ultimate masterpiece” of the Redmi K50 series. Previously, digital blogger @Digital Chat Station said that the final product of the K50 will be released in August. Today, the blogger brought a lot of configuration information about Redmi’s next-generation mobile phone K60 series.
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The blogger said that the current prototype of the next-generation sub-series model is the Dimensity/Snapdragon dual platform of TSMC’s 4nm process, the screen is a flexible 2K screen with a single hole in the center, and a 50-megapixel new outsole main camera, with two fast charging solutions for 100W large batteries. And the optical under-screen fingerprint that many users expect will also return. Combined with the blogger’s previous revelations, the model is probably the Redmi K60 series.
It is worth mentioning that some users said that the new outsole main camera of the Redmi K60 series may be a facelift of the IMX766. The final product of the Redmi K50 series is expected to be named Redmi K50 Ultra, which has previously passed the 3C certification, and the certification shows that it will be equipped with 120W fast charging.
In terms of parameters, it is revealed that the K50 Ultra will use Qualcomm Snapdragon 8+ and MediaTek Dimensity dual flagship platform strategy, with 100W fast charge and large battery, the screen adopts a single-hole straight screen design, equipped with an outsole main camera, and has an off-screen fingerprint.
For reference, among the current Redmi flagship models, Redmi K50 Pro is equipped with Dimensity 9000 processor, adopts Samsung 2K flexible straight screen, built-in 5000mAh large battery, and supports 120W fast charging; Redmi K50 is equipped with Dimensity 8100 processor and adopts the same model as Pro. Samsung 2K straight screen, built-in 5500mAh battery, support 67W fast charge.
