Samsung set to provide HBM3E chips to broadcom

Samsung is making progress in the high-bandwidth memory (HBM) market, with reports suggesting its HBM3E 8-layer chips have passed Broadcom’s quality tests. This achievement could lead to Samsung supplying these advanced memory chips to Broadcom, a major tech company, marking a significant step forward for Samsung’s memory business.

Meanwhile, Samsung is still working to gain approval from NVIDIA, a leading buyer of HBM chips for AI accelerators, but has not yet succeeded. Despite challenges in securing NVIDIA’s approval, Samsung is gaining ground elsewhere. The company has already started supplying HBM3E chips to AMD, which uses them in its latest MI350 Series AI chips with 288GB of memory.

This deal highlights Samsung’s growing role in the AI chip market, even as it competes with rival SK Hynix, which currently dominates NVIDIA’s HBM supply. Broadcom’s approval is a promising sign for Samsung, showing its chips meet high industry standards. If Samsung can also win NVIDIA’s trust, it could boost its position in the booming HBM market, driven by the rising demand for AI technology.

For now, Samsung is preparing for mass production of its HBM3E chips, aiming to strengthen its comeback in the memory chip industry after losing its top spot to SK Hynix earlier this year. This development is a key moment for Samsung as it works to reclaim its leadership in the memory market and meet the growing needs of AI-driven technologies.