Redmi mobile phone promotes Redmi K50 Universe Dimensity dual flagship this afternoon, the official said that this is “the world’s first Dimensity 8100, the world’s second Dimensity 9000, and the models are “high” “Performance”, “low power consumption”, and models beyond imagination.
Your expectations for performance and power consumption in 2022 are met at one time. Every flagship chip you yearn for is covered. More ruthless than the chip is the adjustment investment, and even more ruthless than the investment is the actual measurement. ”
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In December 2021, MediaTek released the Dimensity 9000 chip, which is the first to adopt TSMC’s 4nm advanced process. The CPU adopts the new generation Armv9 architecture for the next ten years, including one Arm Cortex-X2 ultra-large core with the main frequency of up to 3.05GHz.
Moreover, three Arm Cortex-A710 large core with a main frequency of up to 2.85GHz, and 4 Arm Cortex-A510 energy efficiency cores with a main frequency of 1.8GHz, built-in 14MB large-capacity cache combination. Compared with the Android flagship in 2021, the performance is improved by 35%, and the energy efficiency is improved by 37%.
At the beginning of March this year, the Dimensity 8100 chip was released, TSMC 5nm process, the CPU part contains 4 2.85GHz A78 cores + 4 2.0GHz A55 cores, the GPU is Mali-G610 and adopts the self-developed APU 580 architecture. In the CPU running part, the Dimensity 8100 claims to have a 12% increase in multi-core performance and a 44% increase in multi-core energy efficiency compared to competing products at the same level.
Today, Xiaomi Lu Weibing announced the first full-body photo of the new “Mo Yu” of the Redmi K50 series, using a new nano-microcrystalline process.
(via)
